Final bongding machine Anisotropic Conductive Film ACF FPC PCB silicon wafer hot press welding machine Equipment manufacturer

Applicable TO ACF process, mainly used in various FOG, COF, TAB process LCD TO FPC/FPC TO PCB combination binding, zebra crossing hot pressing, the device adopts PLC control system control, touch screen display input, Chinese/English menu page can be selected to use, all parameter Settings browse simple and intuitive. High definition camera alignment, pressure head heating using Omron thermostat constant temperature heating, PID self-tuning temperature control adjustment, through manual and automatic two modes of free control, easy to understand, stable and reliable operation.
Working principle: Through the constant temperature of the hot press head, the wire is bonded to the ACF glue with perfect temperature, time and pressure and with good fit on the bound object.

Equipment characteristics
#The lower pressure of the indenter adopts SMC cylinder with pressing induction, which can accurately control the pressing time;
 #head heating using Omron thermostat constant temperature heating;
#Pressure control adopts SMC precision pressure regulator to ensure the accuracy of pressure, and the pressure head can output stable pressure as soon as it touches the surface of the product;
#The alignment system uses 2 high-definition lenses (4 can be customized) and 15.6 inch large display;
#platform with auxiliary heating function, 2 vacuum adsorption, FPC alignment using three axis fine-tuning platform (customized);Indenter structure adopts professional L-shaped integrated forming structure (patent application), stable downward pressure and accurate binding.